NeoGene Package Module
NeoGene Package Module
The NeoGene Package Module is a liquid cooling thermal module for IC package. The high-power density silicon chip directly contacts the evaporator area of the NeoGene Cooling Engine (a 3D vapor chamber) located outside the heat exchanging chamber. The column shape condenser and the coupled dissipation fins are accommodated inside the heat exchanging chamber that can be filled with a circulating coolant liquid. The heat generated by silicon chip will be efficiently carried away by the circulating liquid.
When IC chips are packaged, the IC Cooling Packed Module is introduced into the packaging process. The process steps are reduced, the process time is shortened, and the computing power and life of the IC chip are improved.The IC Cooling Packed Module is more tightly bonded to the IC chip than Direct-to-Chip, eliminating the thermal resistance of the existing package materials and allowing the IC chip to conduct heat more easily.
| Qmax: | 100W ~ 1,200W |
|---|---|
| Fin#: | 3 / 6 / 9 / 12 |
| Fin Dimension (L x W x H)mm): | 63 x 50 x (9 ~ 36) |
| Solutions: | CPU / GPU /AI / IGBT |
| Material: | CU : C1020 |
| Dimension(L x W x H mm)-A: | 75 x 75 x (21 ~ 48) |
| Dimension(L x W x H mm)-B: | 75 x 75 x (22 ~ 49) |
| Weight(g)-A: | 230 / 295 / 360 / 420 |
| Weight(g)-B: | 230 / 295 / 360 / 420 |